Associate Professor and Distinguished Researcher, School of Information Engineering, Peking University. He is currently a senior member of IEEE, a member of THE MEMS and Nanotechnology Committee of IEEE Industrial Electronics Society, and co-chair of the IECON 2020 Sensor Conference. He received his PhD from Delft University of Technology in the Netherlands, his MASTER's degree from The University of Edinburgh (magna Cum laude), and his bachelor's degree from Nankai University. He has long been engaged in the academic research and industrialization of high-performance sensor interface circuit chips, high-performance analog circuit chips and mixed-signal chips. Research results have been repeatedly published in top international journals and conferences in the field of integrated circuits and sensors (JSSC, ISSCC, TRANSDUCERS, ESSCIRC). From 2017 to 2021, he worked as a senior R&D engineer in the Personal Health and Internet of Things Division of NXP Semiconductors headquarters in the Netherlands, where he presided over several core product r&d projects of NXP, obtained a number of international patents, and successfully commercialized all products. In 2021, he will return to China and join the School of Information Engineering, Peking University. His current research focuses on high-performance analog and mixed-signal chips in the Intelligent Internet of Things and smart home, focusing on fully integrated smart sensor chips, high-precision analog circuits, and high-performance analog and digital conversion chips under CMOS technology.